Hole fillings during PCB manufacturing

Hole fillings during PCB manufacturing

Resin Filling, one of the PCB manufacturing technologies, is used to fill and seal the blind, buried and via-through holes, depending on customer’s design.

There are 4 main functions as follows:

Firstly, the copper in holes is isolated by resin through filling holes to prevent copper oxidation and corrosion and avoiding the de-lamination among layers.

Secondly, Plating over holes’ surface after resin filling can be better for assembling process, which prevents the solder paste from flowing into the hole, so that tin leakage is prevented; besides, it pre-long the shelf life the PCBA product, esp for via-in-pad design.

Thirdly, it improves signal stability. Copper in holes is isolated from power cord by filling with resin, which can reduce crosstalk reaction and improve signal stability.

Fourthly, it reduces impedance. Copper in holes is isolated from signal routes on outer layer by filling with resin, which can reduce capacitance effect and impedance.

Resin Filling Holes is widely used in high-frequency board and HDI board, it meets the requirements of high frequency, high speed, high density, high performance etc.